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Bio and Nano Packaging Techniques for Electron Devices: Advances in Electronic Device Packaging书籍详细信息

ISBN：9783642442865
作者：暂无作者
出版社：暂无出版社
出版时间：暂无出版时间
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适合人群：Engineers in electronics, material science, nanotechnology, semiconductor industry, researchers in microelectronics, and graduate students in related fields
TAG：nanotechnology / Electronics / Microelectronics / Semiconductor Technology / Device Engineering / Packaging
豆瓣评分：暂无豆瓣评分
更新时间：2025-05-20 19:38:23

内容简介：

This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes the effect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their application as packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed; also ways for implementation are described. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces as well as new packaging technologies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers.

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