advanced packaging
关于 advanced packaging 书籍列表
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Three-dimensional Integrated Circuit Design
阅读量：0
ISBN：9780123743435
发布时间：2025-05-17 04:47:50
更多标签
- high-density integration 05-17
- chip stacking 05-17
- three-dimensional IC 05-17
- MOSFETs 05-17
- Bipolar transistors 05-17
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