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Springer New York
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Ultra-thin Chip Technology and Applications书籍相关信息
- ISBN：9781441972750
- 作者：Burghartz, Joachim 编
- 出版社：Springer New York
- 出版时间：2010-11
- 页数：489
- 价格：$ 202.27
- 纸张：暂无纸张
- 装帧：Paperback
- 开本：暂无开本
- 语言：暂无语言
- 适合人群：Engineers, Technologists, Science Enthusiasts, Technology Students, Innovation Researchers, Electronics Hobbyists, Professional Developers, Academic Researchers
- TAG：Engineering / Technology / Electronics / Innovation / Microelectronics / Applications / Semiconductor / Future of Tech
- 豆瓣评分：暂无豆瓣评分
- 更新时间：2025-05-17 11:56:27
内容简介：
Ultra-thin chips are the 'smart skin' of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.